Motherboards

mini ITX

RT Embedded offers a broad range of high quality longevity motherboards from Mini-ITX to full size ATX, covering Embedded and Server market. This variety of motherboards serves the different needs of our customers in almost all applications. These motherboards are based on newest processors and chipset platforms, and utilize Intel advanced technology components.

These longevity motherboards follow international industry size standards with well-defined mounting holes and standard I/O bracket areas. In addition, RT Embedded offers many value-added services like detailed documentation, display support and complete life-cycle management. The Embedded and Server motherboards offer up to 8 years product availability from the release date, based on embedded key components. In applications where permanence and risk avoidance must be optimized, RT Embedded's experience in a variety of markets leads customers to the solution that meets their critical programming and cost objectives.

Mini-ITX

Mini-ITX is the new compact standard motherboard form factor which is mechanically compatible with ATX motherboards. RT Embedded offers Embedded Mini-ITX motherboards with long life and many industrial features.

Flex-ATX

Flex-ATX is a Micro-ATX compatible small factor motherboard standard. Micro-ATX Motherboards use the same power connectors as ATX Motherboards and are compatible with CPUs from major manufacturers.

ATX

ATX-Motherboard is a well accepted PC standard for all types of PC systems. RT Embedded offers a variety of ATX-Motherboards from Pentium-M based low power solution to latest Pentium 4 based solutions to use in industrial applications.

COM Express®

COM Express®

COM Express® defines standardized form factors and pin-outs for Computer-on-Modules. The standard includes the mini form factor (84 x 55mm), the compact form factor (95 x 95mm) and the basic form factor (125 x 95mm).

The COM Express® pin-out Type 6 is a versatile standard offering a broad range of I/O interfaces including intense graphics support, Digital Display Interfaces (DisplayPort, HDMI) and super-fast USB 3.0 to serve all kind of different application requirements of the various market segments

The new COM Express® pin-out Type 7 is a complementary specification to the existing Type 6 pin-out. It is replacing the graphics support by offering multiple 10GbE-KR ports and defining 32 PCIe lanes. The Type 7 is an ideal definition to design server-grade platforms for applications requesting high data and network throughput.

The new COM Express® pin-out Type 10 definition in the mini form factor (84 x 55mm) is well-suited to match the feature and performance requirements of the segments of the embedded market delivering ultra-small solutions.

COMe Basic

COMe Basic modules with a 125x95 mm footprint and pin-out types 2, 6, and 7

COMe Compact

COMe Compact modules with a 95x95 mm footprint and pin-out types 2 and 6

COMe Mini

COMe Mini modules with a 84x55 mm footprint and pin-out type 10

Interfaces

COM Express® defines up to 440 interconnect pins between the COM Express® module and the carrier board. Older interfaces such as PCI, parallel ATA are supported with legacy Type 2 modules. Type 6 modules feature additional PCI Express® 2.0 Lanes, USB 3.0, 3 DisplayPort/HDMI outputs and no longer multiplexes the PEG port with graphic signals.

Server-on-Module

The newly introduced Type 7 pinout was generated to enable server class applications. It features up to four 10 Gb Ethernet ports and up to 32 PCI Express lanes. It‘s designed for headless operation. It does not support any video or audio interfaces but allows for out-of-band management.

Customization

COM Express® is a legacy free standard. Legacy interfaces or custom features are generated on a customized carrier board.

Size

COM Express® describes four different sizes. The low power Type 10 modules are implemented utilizing the Mini (84x55mm²) size. Type 6 modules are implemented for Compact (95 x 95 mm²) and Basic (95 x 125 mm²) form factors while Type 7 modules are currently only available in Basic size. The Extended (155x110 mm²) size is a potential extension for Type 7 modules.

GPIO

COM Express® defines freely usable general purpose inputs and outputs.

Thermal Design

The COM Express® definition includes a heatspreader that acts as a thermal interface between the COM Express® module and the system‘s cooling solution. All heat generating components are thermally conducted to the heatspreader in order to avoid hot spots. The heatspreaders and cooling solutions for the high power modules utilize congatec’s patented high efficient flat heat pipes in order to allow for maximum performance and highest reliability.

PCI Express®

COM Express® offers up to 32 PCI Express® lanes. This allows the customer to equip their embedded PC application with the next generation of PC performance. PCI Express® is a low pin count interface with maximum bandwidth per pin. PCI Express® is defined for a maximum bandwidth of up to 8 GBit/s per lane and direction.

Video Output

Common video outputs for COM Express modules are LVDS for direct flat panel support and up to 3 DDIs (Digital Display Interfaces). Each of the DDI can be switched to TMDS (for DVI or HDMI) or DisplayPort. Future Type 6 modules will also allow for an embedded Displayport. This eDP interface will be multiplexed with the LVDS A channel. Type 7 modules are designed for headless use and does not support direct video outputs.

ETX

ETX®

ETX® - Highly integrated, PC-compatible embedded modules based on x86 CPU architecture – all that on the standard for custom designs (95 x 114 mm). Full featured Multimedia PC based on AMD® processors.

Concept:

Proven, widely established long life standard for X86 based computer modules using the ISA bus.

Benefits:

  1. Mature Standard
  2. Widely accepted and spread in the markets
  3. Easy replacement for existing, ISA-based solutions
  4. Native ISA support for legacy expansion cards and applications

Interfaces:

Item Q'TY
USB 2.0 4
ISA Bus 1
PCI Bus 1
Audio In/Out/Mic 1
IDE 1
Ethernet 10/100 1
SM Bus 1
I²C Bus 1
VGA 1
TV Out 1
LCD LVDS or TTL
Serial 2
LPT / Floppy 1

Connector:

4x 100 pin Hirose

基于龙芯平台的PMON研究与开发

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基于龙芯平台的PMON研究与开发

Date 2019-01-08
File Size 586.2 KB
Download 31

摘要:

在嵌入式软件系统开发中,为了能够快速正确地引导操作系统,需要有一个功能强大的Bootloader来支持。PMON是一种针对嵌入式系统而开发的操作系统引导程序,其作用在于初始化嵌入式硬件系统的外设以便能够正确引导、启动操作系统。基于PMON开发移植的目的,从研究PMON的架构出发,深入研究PMON的编译环境及其执行流程,在此基础上,通过向PMON中添加网卡驱动代码,并验证了网卡驱动工作的正确性,最终实现了PMON下的网卡驱动移植。

基于SOPC基本信号产生器的设计与实现

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基于SOPC基本信号产生器的设计与实现

Date 2019-01-08
File Size 1.28 MB
Download 15

Synopsis

This paper introduces a basic signal generator based on the SOPC design technology.In order to achieve the basic signal generator,the design of system hardware circuit takes EP1C6Q240C8of Altera Corporation as the hardware core,embeds the soft-core CPU into FPGA-chip,and unifies the memory circuit,high-speed DAC circuit,LCD circuit,the keyboard circuit,JTAG configuration circuit,the power circuit and so on.The paper describes the main module design and gives some pictures for hardware and software test.Through the oscilloscope observation,system design requirements are met and the desired objectives are achieved.

基于龙芯2F架构的PMON分析与优化

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基于龙芯2F架构的PMON分析与优化

Date 2019-01-08
File Size 1.01 MB
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摘要:

基本输入/输出系统(BIOS)是现代计算机系统的重要组成部 分,负责计算机系统的开机自检、板级初始化、加载操作系统内核以及基本I/O功能.以龙芯2F CPU架构为研究背景,在其基础上分析了PMON的系统结构与工作流程,通过添加网络驱动程序,最终实现通过PMON加载Linux和VxWorks操作 系统.进行必要的功能完善与性能优化,并经过严格的测试以排除可能存在的深层次缺陷,实现了一个性能稳定、功能完善、高可靠性的能与国产龙芯2F处理器平 台紧密搭配的BIOS.

基于OpenCL的均值平移算法在多个众核平台的性能优化研究

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基于OpenCL的均值平移算法在多个众核平台的性能优化研究

Date 2019-01-08
File Size 1.79 MB
Download 25

摘要:

OpenCL作为一种面向多种平台、通用目的的编程标准,已经对许多应用程序进行了加速。由于平台硬件和软件环境的差异,通用的优化方法不一定在所有平台都有很好的加速。通过对均值平移算法在GPU和APU平台的优化,探讨了不同平台各种优化方法的贡献力,一方面研究各个平台的计算特性,另一方面体会不同优化方法的优劣,在优劣的相互转化中寻求最优的解决方案。实验表明,算法并行优化前、后在AMD 5850、Tesla C2050和APU A6-3650上分别达到了9.68、5.74和1.27倍加速,并行相比串行程序达到79.73、93.88和2.22倍加速,前两个平台OpenCL版本相比,CUDA版本的OpenCV程序达到1.27和1.24倍加速。